Smart manufacturing solutions for processing and packaging

The Industrial Internet Consortium® (IIC™), the worlds leading organization transforming business and society by accelerating the adoption of the Industrial Internet of Things (IIoT), today announced it will exhibit at PACK EXPO International as part of the PACK EXPO International Partner program. With more than 2,500 exhibitors and 50,000 attendees, PACK EXPO International is the worlds largest packaging trade show.

CONFERENCE: PACK EXPO International
DATES: October 14-17, 2018
LOCATION: McCormick Place, Chicago, IL, USA
BOOTH #: Booth N-6001

"Smart manufacturing solutions are essential for the packaging and processing of manufactured goods," said John Kowal, Chair of the IIC Smart Factory Task Group and Director Business Development, B&R Industrial Automation. "At PACK EXPO International, we are delighted to share what we have learned about smart manufacturing from working with manufacturing-related testbeds. IIC testbeds allow us to test products, solutions and processes in order to enhance efficiencies for smart factories."

About Industrial Internet Consortium
The Industrial Internet Consortium is the worlds leading membership program transforming business and society by accelerating the Industrial Internet of Things (IIoT). The IIC delivers a trustworthy IIoT in which the worlds systems and devices are securely connected and controlled to deliver transformational outcomes. The Industrial Internet Consortium is a program of the Object Management Group (OMG). For more information, visit http://www.iiconsortium.org.