MesoGlue: Room Temperature Metallic Glue
From Hanchen Huang of Northeastern University:
MesoGlue is our revolutionary joining solution that lets you attach items together with a metal bond, at room temperature. This is like welding or soldering, but without the heat! The patented process gives you the strength and thermal/electrical conductance of a metal bond, with the ease of attachment of glue or tape. Surfaces are merely pressed together to form a very strong connection.
Our MesoGlue technology can be applied to nearly any flat surface. The surface can be rigid or flexible, and roll-to-roll processing is possible. We currently offer coating of two joining surfaces at our state of the art processing facility. Items of up to approximately 1 cubic foot can be accommodated.
MesoGlue Silver:
A pure silver bond offering the highest electrical and thermal conductivity. Formation of the bond requires moderate pressure.
MesoGlue Eutectic:
A bond made of primarily copper with other metals added to help the process. Formation of the bond requires only fingertip pressure.
(MesoGlue Homepage)
Records 1 to 1 of 1
Featured Product
PI USA - High-Speed Hexapod for Nanopositioning
To meet industrial demands for higher dynamics, reliability and precision in 6DoF positioning systems, PI engineers came up with a new hexapod concept, based on direct-drive lever actuators. This new concept reduces complexity, improves performance, and minimizes wear.
Manufacturing and Automation - Featured Company
PI USA (Physik Instrumente)
PI is a privately held company that designs and manufactures world-class precision motion and automation systems including air bearings, hexapods and piezo drives at locations in North America, Europe, and Asia. The company was founded 5 decades ago and today employs more than 1700 people worldwide. PI's customers are leaders in high-tech industries and research institutes in fields such as photonics, life-sciences, semiconductors and aerospace.
