Additive Manufacturing Users Group Announces Keynote Speakers for 2016 AMUG Conference

Paul Litchfield, Jason Lopes and Todd Grimm will inform, inspire and excite attendees with their discussions of additive manufacturing applications, trends and technologies.

The Additive Manufacturing Users Group (AMUG) today announced its featured keynote speakers for the 2016 AMUG Education & Training Conference, which will be held in St. Louis, Missouri, from April 3 - 7, 2016. Paul Litchfield, Jason Lopes and Todd Grimm will inform, inspire and excite attendees with their discussions of additive manufacturing applications, trends and technologies.


Mark Barfoot, AMUG president, said, "We are very pleased that Jason Lopes and Todd Grimm have once again agreed to share their views and experiences at the AMUG Conference. Both of these men are perennial favorites of our attendees due to their insights and inspirational speaking styles. We are also excited to have Paul Litchfield, the man behind the Reebok Pump and a driving force for additive manufacturing, appear at our conference for the first time. He has some great stories and insights to share."

Todd Grimm, president of T. A. Grimm & Associates and AMUG's AM industry advisor, will open the conference on Monday, April 4th. His presentation, titled "The Age of Innovation," will disclose current and future trends, as well as recent product introductions. Grimm says that he will discuss these developments while offering guidance that will help attendees create strategic and tactical action plans. This will be his sixth appearance as an AMUG keynote speaker.

Jason Lopes of Legacy Effects, returns for his fourth AMUG keynote appearance. Lopes, who is also speaking on Monday, April 4th, has been a world-wide sensation with his visual journeys of the special effects the studio has worked on that have used additive manufacturing. Spanning film, TV and appearances, Lopes pushes the limits of the technology to make amazing physical effects a reality. In his presentation, he will share the tools he has used, the creativity employed and the amazing results that were achieved. Lopes' film credits include Avatar, Terminator Salvation, Alice in Wonderland, Ironman 1, 2 and 3, Avengers 1 and 2, Robocop and Pacific Rim.

Paul Litchfield opens the final day of the conference with "The Legacy of Reebok Innovation in Partnership with Additive Manufacturing," giving attendees insight into Reebok Advanced Concepts operations. Litchfield, now president of Ware Solutions, LLC, was vice president of this Reebok group, which developed innovations like The PUMP, DMX Moving Air and CHECKLIGHT. From his work, Litchfield earned the reputation as one of the most influential product creation experts working in the athletic footwear, performance apparel, and sporting goods industries.

The AMUG Conference will also feature the Innovators Showcase, which is an on-stage conversation with Scott Crump, Stratasys co-founder and chief innovation officer, and a panel discussion with leaders of 10 of the top additive manufacturing companies. The balance of the conference will offer over 200 presentations, workshops and hands-on training sessions. A preliminary agenda is available for download at http://www.additivemanufacturingusersgroup.com/conference_agenda.htm.

The users group conference, now in its 28th year, is open to owners and operators of all additive manufacturing (3D printing) technologies. The advanced, all-inclusive conference registration fee is $795.00. For details and a link to registration, visit http://www.am-ug.com.

Featured Product

The Wire Association International (WAI), Inc.

The Wire Association International (WAI), Inc.

The Wire Association International (WAI), Inc., founded in 1930, is a worldwide technical society for wire and cable industry professionals. Based in Madison, Connecticut, USA, WAI collects and shares technical, manufacturing, and general business information to the ferrous, nonferrous, electrical, fiber optic, and fastener segments of the wire and cable industry. WAI hosts trade expositions, technical conferences, and educational programs.