PACK EXPO International takes place at McCormick Place in Chicago, IL October 14th - 17th. This ManufacturingTomorrow.com Special Tradeshow report aims to bring you news, articles and products from this years event.

ManufacturingTomorrow - Special Tradeshow Coverage<br>PACK EXPO International

Brandon Hetherington for | ManufacturingTomorrow

09/25/18, 08:39 AM | Automation & IIoT, Supply Chain | Pack Expo, packaging, Tradeshows and Conferences, Training and Education
 
General Information

PACK EXPO International is the Packaging Industry’s Main Event

Bringing together end users and suppliers from every packaged goods industry, PACK EXPO International is the largest packaging event in the world in 2018.  With its massive show floor full of machinery in action and packaging solutions for every industry imaginable, attending PACK EXPO International is an experience like none other.

Visit the PACK EXPO Website

Visit our Special Newspage devoted to this years Show
(and post your company news here too)

Product Spotlight

Send us your news releases

Sponsored by:

Featured PACK Q&A's

Talking PACK EXPO with QC Conveyors

Talking PACK EXPO with OMRON

Talking PACK EXPO with Emulate3D

Talking PACK EXPO with Dorner

Talking PACK Expo with Banner Engineering

Talking PACK Expo with Phoenix Contacts

Sophisticated Automation Enhances Precision, Flexibility and Product Safety

Talking PACK EXPO with ATI

Talking PACK EXPO with EWI Ultra Thin Seal

  
What To See at the Show

Exhibitor List

Healthcare Packaging EXPO

Healthcare Packaging EXPO is the pharmaceutical industry’s premier showcase of products, services, logistics suppliers and CMOs that are helping to power innovation in pharma production. For producers of pharmaceuticals, biologics, nutraceuticals and medical devices, the show is a must-attend.

Free Education on the Show Floor

Innovation Stage:  

Drop by Innovation Stage in the Upper North Building and West Building for 30-minute seminars on hot topics and breakthroughs.

The Forum:

NEW THIS YEAR! Gain practical insight and deeper understanding of the impact of trends from free presentations followed by small group discussions and Q &A.

Reusable Packaging:

At this booth in the Reusable Packaging Pavilion, the Reusable Packaging Association offers free presentations about achieving a more sustainable supply chain.
Partners Booth Number

Emulate3D Inc.

E-8902

Encoder Products Company

S-4020

Staubli Corporation

N-4848

Omron Automation

N-4740

Dorner Mfg. Corp.

N-4936

binder USA

E-10129

QC Industries

S-2147 & S-4314

Russell Finex Inc.

N-6330
News Headlines
Universal Robots to Debut New Cobot-Assisted Palletizers and Box-Erectors at PACK EXPO 2018
Roberts PolyPro Introduces Automated Can Handle Applicator for Craft Beer and Spirits
ADLINK IoT Debuting Smart Pallet Experience with Vortex Edge® at PACK EXPO 2018
Epson to Announce and Demonstrate New Robot Solutions at Pack Expo
Rennco Launches New E-Commerce Bagger/Labeler For Faster Packing and Shipping of Mixed-Product Orders
Septimatech Features New Packaging Line Efficiency and Productivity Solutions at Pack Expo International
PackEXPO 2018: Interroll's new drum motor generation and new hygienic solutions in focus
Brenton Brings Affordable Robotic Palletizing to Small- and Medium-Sized Food and Manufacturing Operations
Regional Shows Find a Niche in Crowded Trade Show Landscape
Septimatech Unveils New Easy Adjust Rails® for Fast, Simple, Repeatable Conveyor Guide Rail Changeovers
Pack Expo International 2018: Demand for Single Source Suppliers to Be Met Again by Pearson Packaging Systems' Innovative Packing and Palletizing Solutions
Brenton Delivers Modernized Case Packer Solution
PACK EXPO International and Healthcare Packaging EXPO 2018 is Fast Approaching
Septimatech Introduces New Easy Laner, Servo-Driven Lane Diverter at PACK EXPO International
Orion Revamps Sentry LP, Its Entry-Level Stretch Wrapper
Stäubli Delivers Automated, End-to-End Solutions for Food at PACK EXPO
Stäubli Delivers Robot-Based Automation in a Germ-Free Environment at PACK EXPO
PPWLN Empowers Women in Manufacturing at PACK EXPO
PACK Expo - INTRODUCING THE T18-2 FROM BANNER ENGINEERING: EXTREMELY DURABLE PHOTOELECTRIC SENSORS FOR WASHDOWN AND THERMAL SHOCK ENVIRONMENTS
Emerson Returns to Sponsor Ninth Annual Amazing Packaging Race
PACK EXPO Presentations Geared to Help Improve Manufacturing Operations
PACK EXPO International Offers Solutions for Small to Medium Sized Businesses
CPA Participates at 2018 PACK EXPO International and Co-Located Healthcare Packaging EXPO
AMK Automation Corp. to Showcase Smarter Motion Control Solutions at PACK EXPO Chicago
The Industrial Internet Consortium Discusses Smart Factory Solutions at PACK EXPO

Be Sure To Post Your Show News Announcements Here
It's Free
 
The content & opinions in this article are the author’s and do not necessarily represent the views of ManufacturingTomorrow
09/25/18, 08:39 AM | Automation & IIoT, Supply Chain | Pack Expo, packaging, Tradeshows and Conferences, Training and Education
More Supply Chain Articles | Stories | News

Comments (0)

This post does not have any comments. Be the first to leave a comment below.

Post A Comment

You must be logged in before you can post a comment. Login now.

Featured Product

OnLogic’s Helix 401 Compact Fanless Computer

OnLogic's Helix 401 Compact Fanless Computer

OnLogic's Helix 401 Compact Fanless Computer offers scalable, high-performance processing and can simultaneously drive multiple 4K displays, making it the ideal computing platform for many automation and IIoT applications. The Helix 401 has the horsepower to drive mission-critical applications while requiring less than 28W of power, and is small enough to fit in space-constrained locations or enclosures. It can be configured with a range of Intel® 12th generation processors, up to a Core i7 and has Intel Iris® Xe graphics onboard.
More Products
Feature Your Product