Photonics Array Alignment: Precision Active and Passive Techniques for High-Throughput PIC Production
In this post, we explore the evolution of photonics alignment - from early manual single-fiber setups to today's fully automated FAU (Fiber Array Unit) alignment systems.
How LiDAR Is Paving the Way for Industry 4.0
LiDAR doesn't typically appear on disruptive Industry 4.0 technologies lists, but it may serve a foundational role in preparing facilities for this transition. Here's a closer look.
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OnLogic Karbon 520 Series of Scalable Rugged Computers
The OnLogic Karbon 520 Series of rugged computers is purpose-built to deliver unwavering performance and reliability in the face of extreme temperatures, vibration, and dynamic power conditions. Powered by the latest Intel® Core™ Ultra processors and validated by MIL-STD-810H testing, the Karbon 520 Series makes it possible to deploy dependable computing for AI at the edge, advanced automation, or critical remote and in-vehicle applications in even the most challenging environments.
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CSP US Inc.
As a software manufacturer, CSP GmbH & Co. KG offers its customers bespoke solutions for the discrete manufacturing applications. This makes it easy to secure and document the quality of production processes - from development to delivery!
